AirBorn HD4 interconnect technology for high-speed switch fabrics introduced by Astute

SUFFOLK, Va., 25 Feb. 2015. Astute Electronics Inc. in Suffolk, Va., is introducing the AirBorn high-density, high-reliability HD4 interconnect technology for high-speed switch network fabrics and solid-state data storage applications.

By Mil & Aero staff
By Mil & Aero staff

SUFFOLK, Va., 25 Feb. 2015. Astute Electronics Inc. in Suffolk, Va., is introducing the AirBorn high-density, high-reliability HD4 interconnect technology for high-speed switch network fabrics and solid-state data storage applications.

HD4 was designed to be an electrically optimized and dense physical layer medium for the HyperTransport Technology Consortium's industry-standard HyperShare scalable interconnect technology. Claimed to be the smallest footprint in the industry, HD4 offers high bandwidth, minimized signal loss, and mission-critical reliability.

Although developed for the HyperShare platform, HD4 products also suits many other interconnect standards. The I/O link targets rack-in-cabinet-based systems that require higher bandwidth and density, providing as many as six I/O ports on a 7.4-millimeter pitch along a low-profile PCI Express.

The eight differential pair twinax cable construction enables four channels with 2.5 to 10 gigabits per second data rates per channel.

Related: AirBorn Inc. Acquires AESCO Electronics

The 1A contacts have four points of contact for performance and reliability, and devices can be mated and demated as many as 2500 times. An open-pin weld design allows for flexibility in termination schemes, and die-cast shells provide EMI shielding and simple termination.

For more information contact Astute Electronics online at www.astute.co.uk.

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