XMC/PMC and Rugged COM Express modules for high-temperature environments introduced by X-ES
MIDDLETON, Wis., 22 Sept. 2014. Extreme Engineering Solutions Inc. (X-ES) in Middleton, Wis., is introducing the XPedite8101 Express Mezzanine Card and PCI Mezzanine Card (XMC/PMC))m and XPedite8150 Rugged COM Express modules for applications in demanding high-temperature environments.
The embedded computing modules are based on the Intel Atom E3800 (formerly Bay Trail-I) processor family, which provide computational performance and I/O functionality in a low power profile and size.
They are low power system-on-chip (SoC) processors with integrated graphics and support for to four cores operating at to 1.91 GHz. Along with performance-per-Watt, the E3800 family supports extremely low operating temperatures on power-efficient 22-nanometer technology, company officials say.
With built-in test (BIT) support, configuration and obsolescence management, class III PCB fabrication and assembly, and environmental qualification per MIL-STD-810, the E3800-based modules support boot times and simplify system security by employing Intel's Firmware Support Package (FSP) to power their open source coreboot bootloaders.
X-ES supports the Atom E3800 processor in industry-standard XMC/PMC and Rugged COM Express modules, enabling system integrators to develop one x86-based application on modular hardware solutions that can be tailored for the performance and environmental constraints of each platform.
The E3800-based XPedite8101 XMC/PMC and XPedite8150 Rugged COM Express modules are for platforms with more stringent size, weight, power, cost (SWaP-C) and thermal constraints.
Wind River VxWorks and Linux Board Support Packages, as well as Microsoft Windows drivers, are available for the XPedite8101 and XPedite8150.
For more information contact X-ES online at www.xes-inc.com.