Extreme Engineering Solutions (X-ES) releases embedded ATR system for avionics and vetronics
MIDDLETON, Wis., 20 April 2009 Extreme Engineering Solutions (X-ES) introduced XPand3200, a sub-½ air transport rack (ATR), conduction-cooled system solution targeting dual-core Intel and Freescale CPU cards.
MIDDLETON, Wis., 20 April 2009Extreme Engineering Solutions (X-ES) introduced XPand3200, a sub-½ air transport rack (ATR), conduction-cooled system solution targeting dual-core Intel and Freescale CPU cards.
The ruggedized system is for embedded avionics and vetronics environments and supports VPX and/or cPCI architectures. Additionally, the XPand3200 can be configured to meet custom I/O requirements with various conduction-cooled PMC/XMC or 3rd party modules.
The XPand3200 can be populated with high-performance, low-power 3U VPX or cPCI X-ES single-board computers, such as:
* XPedite7170 targeting Intel® Core2 Duo (SL9380) processor
* XPedite5370 hosting Freescale's dual-core MPC8572E PowerQUICC III processor
* XPedite5170 supporting Freescale's dual-core MPC8640D (with AltiVec) processor
"Customers have told us 'XPand3200 is the highest performance ½ ATR system available today'," states Bret Farnum, VP of Sales. "Adding power supply capable of supporting up to 110ms of hold-up time, plus an array of CPU, FPGA, and I/O options, makes XPand3200 an easy 'design-in' for new programs requiring a MIL-STD-810 system solution."
XPand3200 supports Gigabit Ethernet, graphics, RS-232/RS-422/RS-485, MIL-STD-1553, MIL-STD-188-114A, ARINC 429, discrete I/O, as well as custom conduction-cooled PMC/XMC I/O through the back-panel D38999 circular connectors. A front-panel USB port and removable SATA solid-state memory module are also available.