Huntsman Advanced Materials unveils silver-filled epoxy adhesive

THE WOODLANDS, Texas, 25 Jan. 2007. Huntsman Advanced Materials has introduced a one-component, silver-filled epoxy adhesive that combines high electrical and thermal conductivity with good bond strength. Araldite 7047 epoxy adhesive is a high purity, 100-percent solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards.

THE WOODLANDS, Texas, 25 Jan. 2007. Huntsman Advanced Materials has introduced a one-component, silver-filled epoxy adhesive that combines high electrical and thermal conductivity with good bond strength. Araldite 7047 epoxy adhesive is a high purity, 100-percent solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards. The high-speed dispensable material features an extended work life of up to four days at room temperature and cures in one hour at 165 degrees C (329 degrees F).

ARALDITE 7047 silver-filled epoxy is formulated without solvents or viscosity diluents to reduce potential outgassing.

With its high-temperature performance, the new product is compatible with lead-free processing. Once cured, it exhibits an aluminum/aluminum lap shear strength of 1300 psi and gold/gold die shear of 1700 psi at room temperature.

Volume resistivity at room temperature is <0.0002 ohm-cm, even after 1000 hours aging. The epoxy has a glass transition temperature of 130 degrees C (266 degrees F) and coefficient of thermal expansion of 72 ppm/degree C.

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