Thermal-management for power electronics cooling in thin spaces introduced by Panasonic

MUNICH – Panasonic Automotive & Industrial Systems Europe in Munich is introducing the compressible Soft-PGS thermal interface material (TIM) for electronics cooling and thermal-management in extremely thin spaces -- particularly for power electronics devices.

Jan 31st, 2017
By Mil & Aero staff
By Mil & Aero staff

MUNICH – Panasonic Automotive & Industrial Systems Europe in Munich is introducing the compressible Soft-PGS thermal interface material (TIM) for electronics cooling and thermal-management in extremely thin spaces -- particularly for power electronics devices.

Soft-PGS enhances the thermal coupling between heat-producing devices (heat sources) and heat-dissipation devices (heat sinks).

TIM is a key component in the majority of power electronic systems. Heat generated by semiconductors, has to be transferred to a heat sink and ultimately dissipated.

The Soft-PGS is a 200-micron thick graphite sheet designed as a thermal interface material for insulated-gate bipolar transistor (IGBT) modules.

As Soft-PGS can be compressed by 40 percent it is a solution for reducing thermal resistance between a heat sink and an IGBT module. The 200-micron thick Soft-PGS sheet is easy to install, and has far lower labor and installation costs than thermal grease or phase change material, Panasonic officials say.

Soft-PGS guarantees thermo stability to 400 degrees Celsius and high reliability against intense heat cycles from -55 C to 150 C. Its thermal conductivity is guaranteed at 400 Watts per meter-Kelvin for X-Y direction and at 30 Watts per meter-Kelvin in Z direction.

Panasonic offers a range of standard sheets for different IGBT modules from various suppliers. For more information contact Panasonic Automotive & Industrial Systems Europe online at https://eu.industrial.panasonic.com.

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