ISSYS wins Phase II SBIR grant from NSF for wafer-scale, hermetic, hybrid integration of MEMS and electronics

YPSILANTI, Mich., 23 Oct. 2007. Integrated Sensing Systems Inc. (ISSYS) won a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The two-year project, titled "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed at the development of a novel packaging method to simplify the packaging of MEMS and associated electronics.

Oct 23rd, 2007

YPSILANTI, Mich., 23 Oct. 2007. Integrated Sensing Systems Inc. (ISSYS) won a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The two-year project, titled "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed at the development of a novel packaging method to simplify the packaging of MEMS and associated electronics.

"This technology is highly enabling for commercialization of viable MEMS products," says Dr. Nader Najafi, president/CEO of ISSYS. "The practical hermetic integration of electronics and MEMS devices allows the commercialization of a variety of MEMS-based products that are currently not possible due to high cost of manufacturing or packaging problems. ISSYS' method can be used for a wide variety of devices, in particular, for applications where the MEMS device needs to be in direct contact with the media and the electronics need to be isolated from the environment." Potential applications include industrial, analytical, defense, safety, or biohazard detection applications.

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