For deployed UAV and flight applications. Designed to MIL-STD-810E, DO-160E and MIL-STD-461E. Featuring Dawn’s Thermal Exchanged Flow™ (TEF) Cooling System. Integral 6 channel intelligent 600W power supply configurable through user menu, may be operated in normal or battle short mode. Backplane topology and I/O is Fabric Mapping Modules configurable at time of order. Optional shock isolated tray.

Perfect for everything from electronic warfare and microwave radio to SATCOM and 5G research, these RF relay switches are your versatile solution for diverse broadband applications.

Max contacts, mini size: ODU AMC® High-Density connectors pack up to 27 contacts in a diameter of 7 – 15 mm. Built tough for shock, vibration & water resistance (IP6K8 / IP6K9K). Screw-lock or break-away locking. 360° shielding and up to 5,000 mating cycles.

Infineon’s latest superjunction R9 rad hard P-channel MOSFETs set a new benchmark for robust SOA performance, delivering higher current capability and support in linear-mode applications. PMAD designers can skip larger die sizes or packages and device paralleling for simpler solutions that optimize system efficiency, size and weight. Screened to MIL-PRF-19500, QPL-qualified options are available.

Master Bond EP41S-LO is a two component epoxy adhesive system that combines rapid curing with significant chemical resistance. This epoxy is certified to meet ASTM E595 for NASA low outgassing specifications. It is a highly reliable electrical insulator and is particularly well suited for use in small sized potting applications. Additionally, it has minimal shrinkage upon curing.