MAE Product Showcase - Mar 11th, 2024
 
 
MAE Product Showcase | View online
 
March 11, 2024

Please enjoy the product content from our sponsors below.

XPedite7770 is a rugged, high-performance, 3U VPX single board computer based on the Intel Xeon D-1700 series (formerly Ice Lake-D) of processors. It provides 40 Gigabit Ethernet and accommodates up to 48GB of DDR4 ECC SDRAM in three channels. It integrates SecureCOTS™ technology with a Microsemi PolarFire SoC FPGA for hosting custom functions and supports an XMC site to extend functionality.

Perfect for everything from electronic warfare and microwave radio to SATCOM and 5G research, these RF relay switches are your versatile solution for diverse broadband applications.

LCR’s RTS series chassis continue the system integration process when early benchtop system testing is ready for the next stage. They enable system demonstration at or near application environments for SOSA aligned and VPX payloads. The base design of an RTS chassis allows functional configurability for iterative testing while providing a mechanical design path leading to the deployable system.

Infineon’s latest superjunction R9 rad hard P-channel MOSFETs set a new benchmark for robust SOA performance, delivering higher current capability and support in linear-mode applications. PMAD designers can skip larger die sizes or packages and device paralleling for simpler solutions that optimize system efficiency, size and weight. Screened to MIL-PRF-19500, QPL-qualified options are available.

Master Bond EP46HT-1 is a fast curing epoxy system that offers exceptional physical strength, outstanding dimensional stability and superior chemical resistance. It can withstand intermittent exposures up to +600°F, and has a glass transition temperature of over 240°C. In addition to high temperatures, it is also designed to withstand severe and repeated thermal cycling.