Dual channel MIL-STD-1553 FPGA Mezzanine Card (FMC) reference design using standard IAW VITA 57.1 form factor. Interfaces to a host or FPGA using FMC connectors or two PMOD headers. The card uses Holt’s HI-25850 transceivers, which integrate isolation transformers in the same package, enabling a complete MIL-STD-1553 transformer-coupled interface. A single channel version is also available.

Viking Technology's groundbreaking high-density 16GB DDR4 Multi-Chip Package (MCP), is meticulously engineered to excel in the demanding realms of embedded systems, rugged applications, and military/aerospace markets. Our memory products achieve significantly higher memory performance and density per cubic inch than conventional memory DIMMs.

The DK3HS brings 100Gb signal speeds to our industry bestselling DK3 for VPX development. Supports 25Gb per lane data / 100Gb performance in systems with VPX and SOSA aligned payloads. Early stage system development allows open access and configuration flexibility for fast time to deployment in missions intended for new and emerging defense programs. VITA 67.3 RF and optical I/O connectivity.

Infineon’s latest superjunction R9 rad hard P-channel MOSFETs set a new benchmark for robust SOA performance, delivering higher current capability and support in linear-mode applications. PMAD designers can skip larger die sizes or packages and device paralleling for simpler solutions that optimize system efficiency, size and weight. Screened to MIL-PRF-19500, QPL-qualified options are available.

Master Bond EP30LTE-LO is an epoxy with unparalleled dimensional stability, setting new performance standards for bonding, sealing, casting and coating. This two part epoxy is electrically insulative and resists thermal cycling and many chemicals. It is cryogenically serviceable with a temperature range of 4K to +250°F, ideal for applications where an ultra-low CTE and low outgassing is desirable.