Mill-Max announces versatile additions to our organic fibre plug (OFP®) receptacle line, covering a wide range of lead sizes and offering early engagement/dual entry capability. The OFP® prevents contamination of the critical contact area during assembly and reflow soldering of the receptacle onto the printed circuit board while providing a high reliability and compact connection.
Sensitron has launched the SMCV2, a lightweight digital motor drive module weighing just 350 grams, designed for high-reliability applications operating on a 28V to 900VDC bus and supporting current levels up to 90A. Offered either as a hardware-only solution—allowing for user-developed code—or with included configurable firmware, the SMCV2 delivers high power density in a compact form.
Holt’s HI-6200 family provides a dual redundant MIL-STD-1553 BC/RT/MT or RT-only interface solution including 1553 protocol, ECC SRAM and dual transceivers in compact plastic packages. The devices are register-level software compatible with competitor legacy devices offering significant cost and space saving over older traditional hybrid or multi-chip module approaches.
When performance meets rugged design, innovation happens. The MAGIC2 is a two-slot 3U VPX modular LRU built to thrive in extreme environments. Featuring a 13th-Gen Intel® Core™ i7 CPU paired with an NVIDIA RTX 5000 ADA GPU (delivering up to 42.6 TFLOPS), it’s engineered for AI, radar, video, and situational awareness applications. Discover how the MAGIC2 delivers next-gen processing where it matters most.
Master Bond EP17TF is a one part epoxy with a paste consistency that can be readily dispensed evenly and uniformly. It has a moderately high glass transition temperature (Tg) of 150-155°C and a wide service temperature range from -150°F to +550°F. Designed to compensate for thermal mismatches, this compound resists impact, vibration, shock and rigorous thermal cycling.
