Building Blocks for Deployable Rugged Computing Systems. Elma’s proven backplanes, chassis and boards take your next mission-critical project effortlessly from development to deployment. See our AI-Ready Development platform, all-new VNX+ very small form factor design and SOSA software container blocks - Booth 867 at AUSA Annual Expo, Oct 13-15 in DC.
Holt’s dual channel radiation-hardened 3.3V MIL-STD-1553 transceiver is ideal for high reliability applications such as launch vehicles, high-altitude aircraft, low-orbit satellites and space. The HI-1592 is latch-up immune and proven to withstand a single-event upset (SEU) with an LET of at least 86.3 MeV-cm2/mg. The device is radiation tolerant to a total ionizing dose (TID) of 100 krad(Si).
Acromag’s new VITA 93 QMC mezzanine modules deliver dependable I/O solutions in a compact format. Smaller than XMC and tougher than M.2 or mPCIe, a variety of modules support analog, digital, and serial I/O interfaces for fast, reliable signal processing. More I/O functions coming soon. Designed for SWaP-C applications, these versatile modules are ideal for use in PCIe, VPX, VNX+, and SFF systems.
Master Bond EP21NS is a two part adhesive system used for bonding, coating, sealing and potting/encapsulating. Its nanosilica filler imparts dimensional stability and abrasion resistance. This formulation is a reliable electrical insulator with a volume resistivity greater than 1015 ohm-cm. It is serviceable over the temperature range of -80°F to +250°F and bonds well to a variety of substrates.
ODU AMC® High-Density with Screw-Lock connectors offer a flexible, dual-lock capability with up to up to 27 contacts, and IP68 / IP6K9K waterproofing. The screw-locking principle allows maximum resistance to vibration or the break-away function for quick and easy unlocking is available. It provides high-speed data transfer and a 2-in-1 solution.
