WEBINAR

Engineering for extreme environments: the future of radiation-hardened electronics

From satellites and deep-space missions to missile defense, directed energy, and high-altitude platforms, engineers face growing challenges in designing electronics that can survive and operate reliably in harsh radiation environments. This webinar will examine the latest advances in radiation-hardened and radiation-tolerant semiconductors, packaging, processing architectures, and design techniques that help ensure mission success where conventional electronics cannot survive.
July 08, 2026
6:00 PM UTC
1 hour

Date: Wednesday, July 8, 2026
Time: 2:00 PM (GMT-04:00) Eastern Time - New York
Duration: 60 minutes

Already registered? Click here to log in. 

Radiation effects remain one of the most significant challenges facing designers of aerospace and defense electronics. Spacecraft, satellites, strategic defense systems, and other mission-critical platforms must withstand total ionizing dose (TID), single-event effects (SEE), displacement damage, and other radiation-induced failures that can degrade performance or disable critical systems.

As military and commercial space missions become more ambitious and operational lifetimes increase, the demand for robust radiation-hardened and radiation-tolerant solutions continues to grow.

This webinar will explore the latest advances in radiation-resilient electronics, including rad-hard-by-design methodologies, radiation-tolerant architectures, advanced semiconductor technologies, packaging innovations, and system-level mitigation strategies.

Topics will include approaches to managing single-event upsets, latch-up protection, fault tolerance, reliability verification, and qualification testing.

The discussion also will examine how emerging technologies such as artificial intelligence, high-performance embedded computing, power electronics, and wide bandgap semiconductors are being adapted for operation in radiation-intensive environments while meeting stringent military and aerospace requirements.

Jens Verbeeck

Jens Verbeeck

CEO

Magics Technologies

Jens Verbeeck is the CEO and co-founder of Magics Technologies, a fabless semiconductor company developing highly integrated system-on-chip solutions for space, nuclear, and defense applications. After earning his Master’s degree in Industrial Sciences (Electronics) in 2007, he began his career at Intersoft Electronics as an electronic hardware engineer. In 2008, he pursued a Ph.D. in Electrical Engineering, focusing on the application of electronics in extreme environments. In 2015, he co-founded Magics with Ying Cao, building a highly skilled technical team to advance radiation-hardened electronics using cost-efficient standard CMOS technology. Under his leadership, Magics aims to lower system complexity for next-generation satellites and become the reference provider of integrated, resilient electronic solutions for the aerospace, energy, and defense sectors. Magics Technologies linkedIn

Kenneth A. LaBel

Kenneth A. LaBel

Subject Matter Expert in Space and Military Microelectronics

Trusted Strategic Solutions LLC (TSS)

Graduated with a BES in EECS with a minor in Mathematical Sciences, 1983

His career at NASA included work and leadership in:
- Fault tolerant computing,
- Hardware/software for ground systems,
- Advanced electronics and photonics technology,
- Spaceflight hardware,
- Systems engineering,
- Radiation hardness assurance/research for >200 NASA flight projects, and,
- Microelectronics radiation effects and reliability assurance leadership and management.
He was the program manager of the NASA Electronic Parts and Packaging (NEPP) Program for 15 years as well as group leader for the Radiation Effects and Analysis Group (REAG) at NASA GSFC.
• Over 40 years supporting NASA and other government agencies in the fields of space/military electronics and radiation effects,
• NASA awards including: NASA/Goddard Moe I. Schneebaum (top engineer), QASAR (Quality Assurance Safety and Reliability), NASA National Resource, NASA Honor Award, NASA Exceptional Service Medal
• Published over 200 papers; Taught multiple short courses and multiple invited talks at international and domestic venues
• Active in related conference leadership roles for IEEE, HEART, RADECS and others including as 2009 IEEE NSREC Short Course Chair; 2012 IEEE NSREC Conference Chair; 2018 RADECS Topical Day Chair, 2025 RADECS Short Course Co-Chair
• Winner IEEE NPSS Radiation Effects Award 2023; Winner HEART Society Peter Haas Award 2024
• Supported multiple workforce development activities including Radiation Effects Boot Camps, the Academy for Radiation Effects and Survivability (A4RES), and the new Workforce Advanced Radiation and Practical Testing of Electronics for Nextgen (WARPTEN).

Minh Nguyen

Minh Nguyen

Senior Technical Staff Engineer, FPGA Product Marketing

Microchip Technology Inc.

Minh Nguyen is a senior technical staff engineer for Microchip’s FPGA business unit. Nguyen has more than 20 years of experience in the semiconductor industry, having previously worked as a product engineer at Actel and then as a product marketing manager at Microsemi. Much of her career has been spent focusing on space-qualified FPGAs. She has a Bachelor of Science in electrical engineering and computer science from UC Berkley.