WEBINAR

Engineering for extreme environments: the future of radiation-hardened electronics

From satellites and deep-space missions to missile defense, directed energy, and high-altitude platforms, engineers face growing challenges in designing electronics that can survive and operate reliably in harsh radiation environments. This webinar will examine the latest advances in radiation-hardened and radiation-tolerant semiconductors, packaging, processing architectures, and design techniques that help ensure mission success where conventional electronics cannot survive.

July 08, 2026

6:00 PM UTC

1 hour

Sponsored by

Date: Wednesday, July 8, 2026
Time: 2:00 PM (GMT-04:00) Eastern Time - New York
Duration: 60 minutes

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Radiation effects remain one of the most significant challenges facing designers of aerospace and defense electronics. Spacecraft, satellites, strategic defense systems, and other mission-critical platforms must withstand total ionizing dose (TID), single-event effects (SEE), displacement damage, and other radiation-induced failures that can degrade performance or disable critical systems.

As military and commercial space missions become more ambitious and operational lifetimes increase, the demand for robust radiation-hardened and radiation-tolerant solutions continues to grow.

This webinar will explore the latest advances in radiation-resilient electronics, including rad-hard-by-design methodologies, radiation-tolerant architectures, advanced semiconductor technologies, packaging innovations, and system-level mitigation strategies.

Topics will include approaches to managing single-event upsets, latch-up protection, fault tolerance, reliability verification, and qualification testing.

The discussion also will examine how emerging technologies such as artificial intelligence, high-performance embedded computing, power electronics, and wide bandgap semiconductors are being adapted for operation in radiation-intensive environments while meeting stringent military and aerospace requirements.

Jens Verbeeck

CEO

Magics Technologies

Jens Verbeeck is the CEO and co-founder of Magics Technologies, a fabless semiconductor company developing highly integrated system-on-chip solutions for space, nuclear, and defense applications. After earning his Master’s degree in Industrial Sciences (Electronics) in 2007, he began his career at Intersoft Electronics as an electronic hardware engineer. In 2008, he pursued a Ph.D. in Electrical Engineering, focusing on the application of electronics in extreme environments. In 2015, he co-founded Magics with Ying Cao, building a highly skilled technical team to advance radiation-hardened electronics using cost-efficient standard CMOS technology. Under his leadership, Magics aims to lower system complexity for next-generation satellites and become the reference provider of integrated, resilient electronic solutions for the aerospace, energy, and defense sectors.