3U CompactPCI development system for conduction-cooled embedded computing introduced by X-ES

MIDDLETON, Wis., 3 Aug. 2012. Extreme Engineering Solutions Inc. (X-ES) in Middleton, Wis., is introducing the XPand1201 3U CompactPCI development system for conduction-cooled single-board computers and other embedded computing modules.

This development system for military embedded systems supports as many as eight 3U CompactPCI modules and two optional power supply modules.

With support for rear transition modules (RTMs), the XPand1201 provides I/O flexibility and the ability to prototype deployable systems.

The XPand1201 supports as much as 482 Watts of total simultaneous power delivery and a thermal dissipation of as much as 60 Watts per slot. The embedded systems development platform weighs 20 pounds including backplane and power supply, and measures 16.5 by 5.5 by 11.5 inches.

The XPand1201 can be populated with conduction-cooled 3U CompactPCI modules from X-ES. For more information contact X-ES online at www.xes-inc.com.

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