DARPA pushes ahead with 3-D electro-optical sensors for target identification and tracking

ARLINGTON, Va., 10 March 2013. Government electro-optical sensor researchers will brief industry this week on an advanced initiative to develop fundamentally new avionics and vetronics 3-D electro-optical sensors for target identification and tracking.

Scientists at the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., will host a technical overview and proposer's day conference from 8 a.m. to 2 p.m. this Friday, 15 March 2013, on the second phase of the Military Imaging and Surveillance Technology-Long Range (MIST-LR) program.

The MIST-IR program seeks to develop new kinds of electro-optic sensing for aircraft and ground vehicles to detect and track people and other targets. The program focus is on long-range geometric and 3-D imaging to characterize targets beyond the physical-aperture diffraction-limit of the receiver system.

Industry briefings will be at the DARPA Conference Center, 675 North Randolph St., in Arlington, Va., to provide information on the status and capabilities developed under the MIST program and promote additional discussion.

Those attending will receive details from the first phase of the MIST-LR program and related efforts; hear questions and answers from potential MIST-LR proposers; and have an opportunity to discuss their capabilities and teaming opportunities.

DARPA conducted an industry briefing and released a formal solicitation for the first phase of the MIST-IR program in February 2012. The agency has not publicized any contract awards that may have been made.

The MIST-IR program's second phase will concentrate on new sensing methods and techniques based on computational imaging, synthetic-aperture imaging, digital holography, and multi-static laser radar (ladar).

Optical sensors available today can help identify targets, but their sizes and operational ranges can be limiting, DARPA officials say. The MIST-LR program seeks to develop new sensing methods that address physical aperture of the imaging receiver, the effects of atmospheric turbulence, performance of the receiver array, the power of the illumination source, and the image formation algorithms are the primary defining characteristics of active imaging systems.

The first phase of the MIST-IR program involved a formal preliminary design, at the system and subsystem level to establish the basis for a detailed design; experimental and simulation data validating the concept, approach, and link budget; demonstration of critical hardware and software subsystems; phenomenology measurements; evidence that the proposed designs can be manufactured affordably; and written descriptions of the architecture, design, and subsystems.

Phase 2, meanwhile, will complete the system and subsystems design, and integrate components into one laboratory system to emulate a small-scale imaging capability, as well as demonstrate processing and control software for final system designs. A future third phase will develop and demonstrate a prototype package on an aircraft or ground test range.

Those interested in attending the MIST-IR phase-two briefings should register no later than this Wednesday, 12 March 2013, by email to BAA-13-27@darpa.mil. Put MIST Conference Registration in the subject line. A SECRET security clearance is required to attend.

Email questions or concerns to DARPA at BAA-13-27@darpa.mil. More information is online at https://www.fbo.gov/spg/ODA/DARPA/CMO/DARPA-SN-13-28/listing.html.


Military & Aerospace Photos

Most Popular Articles

Related Products

CPU-PPC460EX-VME Processor Board

The CPU-PPC460EX-VME PowerPC processor board is designed for rugged, conduction and convection co...

XFP Transceiver Modules

Quagwire Technologies offers a full catalog of 10GbE Optical XFP Transceivers encompassing 10G pr...

ClipIR Small Clip On Thermal Imager for Fused Night Vision

ClipIR - Small Clip-On Thermal Imager for Fused Night Vision (thermal imaging/ I2) to see in tota...

MicroCAM 2 Thermal Imaging Modules

Thermoteknix’ patented shutterless MicroCAM® 2 thermal imaging module – a featherweight 30g (1oz)...

Scantech Laser Pvt. Ltd.

Scantech Laser designs & manufacture custom built laser machines for all global industries of tod...

VDK3000 - Laser Deposition or Cladding

Metal Laser deposition and cladding solution. ModusCAM Solidworks path planning

VDK4000 - 3D Printing

F.R.E. - Flexible Robotic EnvironmentDirect writing 3D robotic systemModusCAM - Solidworks path p...

TiCAM 750 Handheld Thermal Imaging Binoculars

Handheld thermal imager for military and civilian applications including special forces, search &...

LASCAD

Thermal and Structural FEA, Gaussian ABCD and Physical Optics Code are integrated in LASCAD to an...

SpectraTec X

The SpectraTec X, a Multi-Laser Source is the first all fiber technology for combining up to 4 in...

Related Companies

Beyond Electronics Corp

Beyond Electronics(BEC) provides Rugged COTS board and system level solutions in various small form factor products c...

Federal Electronics Inc

Provides electronic manufacturing services focusing on military/high-end commercial applications. Services include ad...

TE Connectivity

Designs and manufactures a range of connectors, rugged electro-optic components, and assemblies, RF products, wire, c...

Sabritec

Specializes in the design and manufacture of filter connectors, Fibre Channel, Ethernet, IEEE 1394 FireWire, electro-...

LEONI Fiber Optics Inc

Manufactures electro-optic devices for spectroscopy, laser delivery and manipulation, sensing, and process control. P...

Gooch & Housego Plc

World leading expertise across a broad range of optical technologies including acousto-optics, electro-optics, fiber ...

Amphenol Industrial Operations

Provides a range of high reliability connectors and interconnection systems specifically for industrial markets, incl...
Wire News provided by   

Press Releases

One Component, Snap Cure Epoxy Features High Strength Properties

Suitable for a variety of applications in the electronic, aerospace and OEM industries, Master Bond EP3SP5F...

One Part Epoxy Resists up to 500°F and Meets NASA Low Outgassing Specifications

Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in...

Low Viscosity, One Part Cyanoacrylate Is Non-Toxic and Meets ISO 10993-5 Specifications

Master Bond MB250NT is widely used for a variety of applications ranging from repair to high speed producti...

Thermally Conductive, Two Component Epoxy Passes USP Class VI Tests and ISO 10993-5 Specifications

With biocompatibility and cytotoxicity certifications, Master Bond EP21AOLV-2Med is often selected for bond...

CURTISS-WRIGHT CONGRATULATES NORTHROP GRUMMAN ON SUCCESSFUL FIRST FLIGHT OF SECOND MQ-4C TRITON UAS

Curtiss-Wright Corporation’s Defense Solutions division applauds Northrop Grumman Corporation (NYSE: NOC) o...

Curtiss-Wright’s New Rugged Mobile IP Router Subsystem Features an Integrated Cisco® 5915 ESR Router

Curtiss-Wright Corporation today announced that its Defense Solutions division, a Cisco® Systems Solution T...

VICTORY Shared Processing, Fire Control Computer, and Switch for Ground Vehicles Introduced by Curtiss-Wright

Curtiss-Wright Corporation today announced that its Defense Solutions division has introduced a new fully i...

GE Announces First Sub-Credit Card-Sized Multi-Function High Definition (HD) Video Tracker

HUNTSVILLE, AL.— OCTOBER 13, 2014—GE’s Intelligent Platforms business today announced at AUSA (October 13-...

Webcasts

Meeting the Gen3 backplane challenge with OpenVPX and COTS

Tight Pentagon budgets mean military systems must stay in the field for longer than ever before. This doesn't mean obsolete technology, however. Today's military electronics are being upgraded constantly, an...
Sponsored by:

Design Strategy Considerations for DO-178C Certified Multi-core Systems

Join Wind River to learn how system architecture and design choices can minimize your DO-178C certification challenges.

Sponsored by:

Flying, Sailing or Driving - The Rugged, Embedded Intel-based Server that goes where you need it!Flying Sailing or Driving

Leveraging the power of server-class processors is no longer relegated to the confines of data centers. Through several innovations, Mercury Systems has ruggedized Intel’s server-class chips for deployment. ...
Sponsored by:

All Access Sponsors


Mil & Aero Magazine

April 2015
Volume 26, Issue 4
file

Download Our Apps



iPhone

iPad

Android

Follow Us On...



Newsletters

Military & Aerospace Electronics

Weekly newsletter covering technical content, breaking news and product information
SUBSCRIBE

Cyber Security

Monthly newsletter covering cyber warfare, cyber security, information warfare, and information security technologies, products, contracts, and procurement opportunities
SUBSCRIBE

Defense Executive

Monthly newsletter covering business news and strategic insights for executive managers
SUBSCRIBE

Electronic Warfare

Quarterly newsletter covering technologies and applications in electronic warfare, cyber warfare, optical warfare, and spectrum warfare.
SUBSCRIBE

Embedded Computing Report

Monthly newsletter covering news on embedded computing in aerospace, defense and industrial-rugged applications
SUBSCRIBE

Unmanned Vehicles

Monthly newsletter covering news updates for designers of unmanned vehicles
SUBSCRIBE