Rugged conduction-cooled MicroTCA embedded computing boards introduced by VadaTech

Aug. 22, 2013
HENDERSON, Nev., 22 Aug. 2013. VadaTech in Henderson, Nev., is introducing a conduction-cooled ecosystem of embedded computing boards and chassis in the MicroTCA architecture for rugged applications.

HENDERSON, Nev., 22 Aug. 2013. VadaTech in Henderson, Nev., is introducing a conduction-cooled ecosystem of embedded computing boards and chassis in the MicroTCA architecture for rugged applications.

The products include air transport racks (ATR), MicroTCA carrier hubs (MCH), power modules, and Advanced Mezzanine Cards (AMCs).

Compliant to MicroTCA.3 specification, the boards and chassis come in various sizes and formats. The MCH, which acts as a shelf controller, features a 400 MHz RISC CPU for high performance and low latency.

The power modules provide true hot-swappability in a dual 10-to-36-volt input and outputs to 800 Watts. They also have dual intelligent platform management interface (IPMI) and two banks of 256K Flash for redundancy.

Several of VadaTech's AMCs are in the conduction-cooled format. The company is also able to modify standard AMCs to ruggedized versions with wedge locks.

The VadaTech ATRs come in one-half and three-quarter short sizes with long and tall versions available. Customized chassis and module solutions are available.

For more information contact VadaTech online at www.vadatech.com.

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