CMOS X-Ray camera for non-destructive test and circuit board inspection offered by Teledyne

May 22, 2014
WATERLOO, Ontario, 22 May 2014. Teledyne DALSA in Waterloo, Ontario, is introducing the Rad-icon 1520 CMOS X-Ray camera for industrial X-ray inspection, scientific imaging, and non-destructive testing, including weld inspection, wire bond and printed circuit board (PCB) inspection, microfocus, computed tomography (CT) and other demanding industrial imaging applications.
WATERLOO, Ontario, 22 May 2014. Teledyne DALSA in Waterloo, Ontario, is introducing the Rad-icon 1520 CMOS X-Ray camera for industrial X-ray inspection, scientific imaging, and non-destructive testing, including weld inspection, wire bond and printed circuit board (PCB) inspection, microfocus, computed tomography (CT) and other demanding industrial imaging applications.

The Rad-icon 1520 electro-optical detector features 1548-by-2064-pixel resolution, an active area of 15.3 by 20.4 centimeters, and 99 micron pixel size. Rad-icon detectors deliver real-time frame rates to 30 frames per second, sensitivity, and resolution in a large area device that is integrated and available with a Gigabit Ethernet or Camera Link interface.

Rad-icon digital X-ray cameras leverage Teledyne DALSA's advanced CMOS image sensing technology that enables the delivery of higher image quality than a-Si flat panels and image intensifier devices.

Other features include 5 lp/mm resolution; energy range from 10 to 225 kilovolts; 14-bit digitization of images; and SDKs, drivers and programming support.

For more information contact Teledyne DALSA online at www.teledynedalsa.com/rad-icon.

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