Companies to offer logic in BGA packaging
Leaders of three influential semiconductor companies are sourcing several logic devices with the same functionality and pin-outs in fine-pitch ball grid array packaging. These devices are for space-constrained applications such as base stations, handheld computers, networking, and wireless telephones. The companies offering these new devices are Integrated Device Technology Inc. of Santa Clara, Calif., Philips Electronics N.V. in Eindhoven, The Netherlands, and Texas Instruments in Dallas. IDT,