Companies to offer logic in BGA packaging
Leaders of three influential semiconductor companies are sourcing several logic devices with the same functionality and pin-outs in fine-pitch ball grid array packaging. These devices are for space-constrained applications such as base stations, handheld computers, networking, and wireless telephones. The companies offering these new devices are Integrated Device Technology Inc. of Santa Clara, Calif., Philips Electronics N.V. in Eindhoven, The Netherlands, and Texas Instruments in Dallas. IDT,
Leaders of three influential semiconductor companies are sourcing several logic devices with the same functionality and pin-outs in fine-pitch ball grid array packaging. These devices are for space-constrained applications such as base stations, handheld computers, networking, and wireless telephones. The companies offering these new devices are Integrated Device Technology Inc. of Santa Clara, Calif., Philips Electronics N.V. in Eindhoven, The Netherlands, and Texas Instruments in Dallas. IDT, Philips, and TI officials have defined a ball grid array package with a 0.8-millimeter ball pitch, 0.5-millimeter ball size, and nominal height of 1.4 millimeters. The 96-ball package takes 74.25 square millimeters of board space. For more information, contact the TI Semiconductor literature response center by phone at 800-477-8924, ext. 4500, or by post at P.O. Box 172228, Denver, Colo. 80217. - J.K.
