Irvine Sensors to power wearable computer

April 1, 1998
Engineers from Irvine Sensors Corp. of Costa Mesa, Calif., are using their proprietary chip-stacking technology to develop a computer in a cube for a future wearable infantry computer. Designers from The Boeing Co. in Huntsville, Ala., will use the Irvine cube computer in the wearable computer, which is to be about the size of a deck of cards that will provide future infantry soldiers with hands-free, voice-activated controls. This project, under sponsorship of the U.S. Defense Advanced Research

Engineers from Irvine Sensors Corp. of Costa Mesa, Calif., are using their proprietary chip-stacking technology to develop a computer in a cube for a future wearable infantry computer. Designers from The Boeing Co. in Huntsville, Ala., will use the Irvine cube computer in the wearable computer, which is to be about the size of a deck of cards that will provide future infantry soldiers with hands-free, voice-activated controls. This project, under sponsorship of the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., is called "Independent Processor Module," which is to be part of DARPA`s Advanced Humionics Platform. This is to provide the future warfighter with a portable suite of electronics and sensors to help him cope with operational and support needs. - J.K.

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