9-gigabit solid-state memory introduced by Microsemi for mission-critical aerospace and defense applications

PHOENIX, 5 July 2011. The Microsemi Corp. Power and Microelectronics Group in Phoenix is introducing a 9-gigabit solid-state memory device based on DDR3 SDRAM for small, fast systems in mission-critical applications such as missile systems, munitions, secure communications that operate in demanding environments at extended-temperatures. The solid-state memory device is packaged in one plastic ball grid array (PBGA) as a compact x72 dual in-line memory module (DIMM).

PHOENIX, 5 July 2011. The Microsemi Corp. Power and Microelectronics Group in Phoenix is introducing a 9-gigabit solid-state memory device based on DDR3 SDRAM for small, fast systems in mission-critical applications such as missile systems, munitions, secure communications that operate in demanding environments at extended-temperatures. The solid-state memory device is packaged in one plastic ball grid array (PBGA) as a compact x72 dual in-line memory module (DIMM).

The memory device helps designers pack as much as 4-gigabyte memory densities into small system designs. The commercial off-the-shelf (COTS) DDR3 SDRAM devices offers designers a standalone, high-density memory solution, Microsemi officials say. The DDR3 devices help reduce space requirements compared to systems built with discrete memory. The memory device also helps designers streamline I/O routing and reduce component count, company officials say.

For more information contact Microsemi Power and Microelectronics online at www.whiteedc.com.

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