High-throughput data connectors for artificial intelligence (AI) applications introduced by Samtec
Summary points:
- Samtec's APM6 and APF6 connectors deliver high-speed data transmission, supporting as fast as 112 gigabits per second PAM4 for applications in HPC, AI, and data storage.
- These connectors offer a low-profile 5-millimeter stack height, with protocol compatibility for PCI Express 6.0, CXL 3.2, and 100 Gigabit Ethernet.
- Samtec's Solder Column Termination method enhances the structural integrity of the connectors to ensure high reliability and low insertion loss in dense, high-speed environments.
NEW ALBANY, Ind. – Samtec Inc. in New Albany, Ind., is introducing the 800-position APM6 and APF6 high-performance array connectors for high-throughput applications like high-performance computing (HPC), artificial intelligence (AI), data storage, and networking.
These AcceleRate HP connectors deliver signal integrity and density, and support data rates as fast as 112 gigabits per second PAM4 on a 0.635-millimeter pitch. The APM6 and APF6 high-performance array connectors are available in a low-profile 5-millimeter stack height.
Features of these high-throughput data connectors include protocol compatibility with PCI Express 6.0, CXL 3.2, and 100 Gigabit Ethernet; 800-position configuration in a 68.62-millimeter by 18.20-millimeter size; 5-millimeter mated stack height, with a 10-millimeter version planned for Q2 2026; 5 Ohm impedance; and open-pin field array design for grounding and routing.
The APM6 and APF6 connectors use Samtec's Solder Column Termination to enhance structural integrity. This IPC Class 3-compliant method is for dense high-speed interconnects and offers solder joint reliability and insertion loss and return loss performance.
For more information contact Samtec online at www.samtec.com.
