SAN DIEGO – Congatec Inc. in San Diego is introducing 10 COM-HPC and COM Express computers-on-modules with Intel Core mobile and desktop processors, formerly code named Alder Lake, for next-generation internet of things (IoT) and edge applications.
The modules come in COM-HPC size A and C as well as COM Express Type 6 form factors. The modules offer as many as 14 cores and 20 threads on BGA and 16 cores and 24 threads on LGA-mounted desktop variants.
Applications include autonomous vehicles, industrial vision, real-time collaborative robotics, mobile machines, video security and gateways, smart factories, process automation, and autonomous logistics vehicles.
Related: Artificial intelligence and embedded computing for unmanned vehicles
Optimized for high embedded client performance, the graphics of the LGA processor based modules deliver as much as 94 percent faster performance and its image classification inference performance has nearly tripled with as many as 181 percent higher throughput.
The embedded computing modules offer bandwidth to connect discrete graphics processing units (GPUs) for maximum graphics and general-purpose GPU-based artificial intelligence (AI).
Compared to the BGA versions, these peripherals benefit from doubled lane speed as they come with PCI Express 5.0 interface technology in addition to PCI Express 4.0 off the processor.
Furthermore, the desktop chipsets provide as many as eight times more PCI Express 3.0 lanes for additional connectivity and the mobile BGA variants also offer as many as 16 PCI Express 4.0 lanes off the CPU and as many as eight PCI Express 3.0 lanes off the chipset.
The COM-HPC Client and COM Express Type 6 modules offer dedicated AI engines that support Windows ML, Intel Distribution of OpenVINO toolkit, Chrome Cross ML, support for the Real-Time Systems hypervisor technology, and OS support for Real-Time Linux and Wind River VxWorks.
For more information contact www.congatec.com.
