LIBERTY, S.C. – Sealevel Systems Inc. in Liberty, S.C., is introducing the 12009 COM Express Compact Type 6 evaluation board to enable accelerated development of embedded computing prototypes, expedite electrical hardware engineering, and reduce costs for new product introductions.
Originally developed to control wearable robotic exoskeletons, the board design has expanded in functionality while maintaining a mandated extremely small footprint.
At 95 millimeters square, the 12009 is identical in size to a Compact Type 6 COM Express module, and is for a wide variety of applications.
Standard I/O includes Gigabit Ethernet, USB 3.0, USB 2.0, GPIO, RS-232, and Mini DisplayPort. The carrier board is designed for the congatec conga-TC370 COM Express family, with support for 8th generation Intel Core processors.
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The board offers as much as 64 GB DDR4 RAM, and TPM 2.0 support. The 12009 operates in temperatures from 0 70 degrees Celsius, and is powered via a locking four-position Molex Micro-Fit connector.
The complete evaluation kit (Part #12009-001-KT) includes a Type 6 module with Intel Core i3-8145UE CPU and 8 gigabytes DDR4 RAM, and includes a 128-gigabyte M.2 SATA SSD module that supports Windows and Linux operating systems.
The evaluation board kit has a desktop power supply and cables to facilitate connections to serial and Ethernet ports and optional fans. A power button and power-indicating LED are also included.
For more information contact Sealevel Systems online at www.sealevel.com.
