Companies develop high-temperature IndustryPack

Circuit board engineers from DY 4 Systems of Kanata, Ontario, and from SBS GreenSpring Modular I/O in Menlo Park, Calif., are joining hands to develop a conduction-cooled IndustryPack mezzanine board for high-temperature military and aerospace applications. The IndustryPack mezzanine board fits on VME boards and is about the size of a credit card. Until now there has been no conduction-cooled IndustryPack, claim DY 4 officials. DY 4 engineers will fabricate the conduction-cooled cards, which wil

Jul 1st, 1998

Circuit board engineers from DY 4 Systems of Kanata, Ontario, and from SBS GreenSpring Modular I/O in Menlo Park, Calif., are joining hands to develop a conduction-cooled IndustryPack mezzanine board for high-temperature military and aerospace applications. The IndustryPack mezzanine board fits on VME boards and is about the size of a credit card. Until now there has been no conduction-cooled IndustryPack, claim DY 4 officials. DY 4 engineers will fabricate the conduction-cooled cards, which will be software-compatible with the new SBS GreenSpring VME64x-compliant VIPC664 quad carrier board and with several selected GreenSpring IndustryPack modules. DY 4 also will offer SBS GreenSpring commercial-grade, air-cooled version of the product for systems prototyping. For more information, phone DY 4`s Doug Patterson by phone at 540-341-2103. - J.K.

More in Computers