GreenSpring unveils 3U VME IndustryPack

Engineers at SBS GreenSpring Modular I/O in Menlo Park, Calif., are introducing their VIPC360 3U VME dual IndustryPack carrier board. The new component, which has two IndustryPack sites and a 32 MHz MC68EN360 QUICC communications processor, is intended for high-density, high-performance solution for ruggedized control and telecommunications applications. The carrier board supports A24, A16 VMEbus master and slave with slot-one capabilities such as arbiter. It includes one 1 megabit of flash memo

Feb 1st, 1998

Engineers at SBS GreenSpring Modular I/O in Menlo Park, Calif., are introducing their VIPC360 3U VME dual IndustryPack carrier board. The new component, which has two IndustryPack sites and a 32 MHz MC68EN360 QUICC communications processor, is intended for high-density, high-performance solution for ruggedized control and telecommunications applications. The carrier board supports A24, A16 VMEbus master and slave with slot-one capabilities such as arbiter. It includes one 1 megabit of flash memory and 4 megabits of DRAM for 68360 code and communications data. Other features include 10BaseT Ethernet interface, battery-backed real-time clock, and RS-232 interface. For more information, contact GreenSpring by phone at 650-327-1200, or on the World Wide Web at http://www.greenspring.com/. - J.K.

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