- Computers
Packaging for rad-hard ASICs and FPGA-to-ASIC conversions
Aeroflex Inc. in Colorado Springs, Colo., is offering radiation-hardened packaging for application-specific integrated circuits (ASICs) for improved simultaneous switching output response, and is offering an external chip capacitor attachment option for the UT0.25 m m rad-hard ASICs and for FPGA-to-ASIC conversions.