CETIA offers heat sink for COTS boards

CETIA Inc. of Cambridge, Mass., is offering its "Ruggedizer" board-level heat drain attachment that helps designers adapt commercial off-the-shelf printed circuit boards for severe-environment field applications. The attachment fits onto CETIA`s PowerPC VME single board computers to extend the thermal and mechanical operating range of the original commercial hardware. The Ruggedizer uses a 3-D laser scan technique that custom fits the heat sink to each board with tight mechanical tolerances and high thermal dissipation capacity. For more information, phone CETIA at 617-494-0987. - J.K.