Air Force chooses AMI Semiconductor to make rad-hard chips

POCATELLO, Idaho, 11 Oct. 2005. U.S. Air Force officials are looking to AMI Semiconductor Inc. in Pocatello, Idaho, to make radiation hardened cryogenic read out integrated circuits.

Oct 11th, 2005

POCATELLO, Idaho, 11 Oct. 2005. U.S. Air Force officials are looking to AMI Semiconductor Inc. in Pocatello, Idaho, to make radiation hardened cryogenic read out integrated circuits.

AMI is doing the work under terms of a $6.7 million contract from the Air Force Research Laboratory at Wright-Patterson Air Force Base, Ohio. The contract number is FA8650-05-2-5506.

AMI experts are to provide for research to establish a viable, domestic manufacturing capability for commercial production of rad-hard cryogenic read out integrated circuits.

AMI will do the work at Anteon in Fairfax, Va. and at Universal Technology in Dayton, Ohio. Work is to be finished by April 2007.

More in Computers