Rugged Type 6 COM Express embedded computing module for aerospace and defense introduced by GE

HUNTSVILLE, Ala., 27 March 2015. GE Intelligent Platforms in Huntsville, Ala., is introducing the bCOM6-L1700 rugged Type 6 COM Express embedded computing module for aerospace, defense, heavy industry, energy exploration, and transportation applications.

Mar 27th, 2015
By Mil & Aero staff
By Mil & Aero staff

Editor's note: GE Intelligent Platforms changed its name to Abaco Systems on 23 Nov. 2015 as a result of the company's acquisition last September by New York-based private equity firm Veritas Capital.

HUNTSVILLE, Ala., 27 March 2015. GE Intelligent Platforms in Huntsville, Ala., is introducing the bCOM6-L1700 rugged Type 6 COM Express embedded computing module for aerospace, defense, heavy industry, energy exploration, and transportation applications.

The board has R-Series System-on-Chip (SoC) from AMD for throughput and graphics capabilities. The bCOM6-L1700 itself is available in two performance-per-Watt variations, and has as much as 16 gigabytes of soldered memory.

Its inherently rugged design makes the bCOM-6-L1700 suitable for deployment in harsh environments subject to extremes of temperature, vibration, and shock. Extended mechanical construction protects the module, and has optional conformal coating resistance to moisture, dust, chemicals, and temperature extremes.

Related: Mini COM Express module for military applications in image, video, and sensor processing introduced by GE

The bCOM6-L1700 supports four SATA interfaces, a Gigabit Ethernet port, eight USB 2.0 and four USB 3.0 ports, and either eight GPIO ports or an SD Card interface.

For more information contact GE Intelligent Platforms online at www.geautomation.com/industries/defense.

More in Computers