Adhesive with low coefficient of expansion for aerospace uses introduced by Master Bond

Jan. 26, 2015
HACKENSACK, N.J., 26 Jan. 2015. Master Bond Inc. in Hackensack, N.J., is introducing the EP42HT-2LTE two-component epoxy for a variety of bonding, sealing, coating and select casting applications in the electronics, aerospace, optical, and specialty OEM industries.

HACKENSACK, N.J., 26 Jan. 2015. Master Bond Inc. in Hackensack, N.J., is introducing the EP42HT-2LTE two-component epoxy for a variety of bonding, sealing, coating and select casting applications in the electronics, aerospace, optical, and specialty OEM industries.

This adhesive has a flowable paste consistency that enables precise alignment with minimal fixturing, company officials say. It cures at room temperature, or more quickly with the addition of heat.

This adhesive has a low coefficient of expansion, and a tensile lap shear strength of more than 1,200 psi. It bonds well to a wide variety of similar and dissimilar substrates, including metals, composites, ceramics, glass, and many plastics.

Related: Electrically insulating epoxy adhesive that resists water and oils introduced by Master Bond

The EP42HT-2LTE features superior electrical insulation properties, chemical resistance and dimensional stability over the wide service temperature range of -60 to 300 degrees Fahrenheit. It also offers low linear and volumetric shrinkage upon curing, which is useful for potting and encapsulation applications.

Featuring a light cream color, EP42HT-2LTE is prepared using a non-critical 100 to 40 mix ratio by weight or a 100 to 50 mix ratio by volume. After mixing a 100 gram batch, its working life is 60 to 90 minutes open time.

For more information contact Master Bond online at www.masterbond.com.

About the Author

John Keller | Editor

John Keller is editor-in-chief of Military & Aerospace Electronics magazine, which provides extensive coverage and analysis of enabling electronic and optoelectronic technologies in military, space, and commercial aviation applications. A member of the Military & Aerospace Electronics staff since the magazine's founding in 1989, Mr. Keller took over as chief editor in 1995.

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