HALSTENBEK, Germany, 11 Oct. 2016. TEWS Technologies GmbH in Halstenbeck, Germany, is introducing the TPCE278 PCI Express carrier board for embedded computing applications in harsh environments like process control, medical systems, telecommunications, and traffic control.
The standard-height PCI Express Revision 3.0 compatible module provides one slot for a single-width Switched Mezzanine Card (XMC) module. Designed for demanding environments, the TPCE278 operates from -40 to 85 degrees Celsius.
The TPCE278 is designed to upgrade XMC I/O solutions to the PCI Express signalling standard. The PCI Express x4 link from the host board to the XMC module is enhanced by a PCI Express Gen3 Redriver, allowing safe operation of XMC modules on PCI Express main boards.
The device's vehicle power supply voltage (VPWR) is selectable between 12 and 5 volts via order option. The TPCE278 supports XMC front panel I/O, and also P14 and P16 rear I/O independently.
XMC P14 rear I/O is provided through a Tyco AMPMODU System 50 0.050x0.100 flat ribbon cable connector. The I/O lines are routed differential.
XMC P16 rear I/O is implemented through two Samtec QTH-DP 0.50mm Q Pairs High Speed Ground Plane Socket Strip, Differential Pair connector providing access to all P16 I/O lines.
The PCI Express edge card connector provides 12 and 3.3 volts. The TPCE278 uses the +12V of the PCI Express edge card connector to generate all power supply voltages for the XMC slot (+3.3V, VPWR and +12V).
For increased power requirements of an XMC module, TEWS offers TPCE278 variants with a PCI Express graphics power connector to supply the +12V for generating all the power supply voltages for the XMC slot providing power to 75 Watts.
A 10-pin JTAG header is available for XMC module debugging. All five JTAG signals are routed to the XMC slot. For more information contact TEWS Technologies online at www.tews.com.
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