Small-form-factor ATR conduction-cooled chassis for OpenVPX and MicroTCA introduced by Pixus
WATERLOO, Ontario, 26 May 2016. Pixus Technologies Inc. in Waterloo, Ontario, is introducing conduction cooled chassis in the ATR format or in specialty Small Form Factor (SFF) designs for OpenVPX and MicroTCA architectures.
WATERLOO, Ontario, 26 May 2016. Pixus Technologies Inc. in Waterloo, Ontario, is introducing conduction-cooled embedded computing chassis in the ATR format or in specialty small-form-factor (SFF) designs for OpenVPX and MicroTCA architectures.
The Pixus conduction-cooled ATRs come in standard 1/2 and 3/4 sizes for 3U or 6U boards. There are also options for the MicroTCA.3 hardened form factor as well as heat exchanged versions.
The enclosures are designed to meet MIL-STD-704, MIL-STD-810G, and MIL-STD-461. Off-the-shelf power interface boards are available to incorporate VITA 62 or PICMG 2.9 power supplies. For specialty designs or those looking to minimize size, weight, and power (SWaP), Pixus also offers application-specific conduction cooled solutions.
Pixus provides rugged and 19-inch rackmount enclosures in several backplane architectures including OpenVPX, MicroTCA, AdvancedTCA, and legacy CompactPCI/VME. The company also provides specialty backplanes and handle/panel sets for embedded boards.
For more information contact Pixus Technologies online at www.pixustechnologies.com.