Both connector series are for mating boards in a perpendicular orientation or for parallel, daisy chaining applications. The centerline mating height is .0435 inches from the board surface with a total profile height of .087 inches.
The fine pitch and low profile are desirable for dense packaging requirements while maintaining the durability and reliability expected of quality interconnect components.
The right angle, 854-22-0XX-20-001101, is a through-hole mount connector with .016-inch-diameter solder tails suitable for board thickness to .100 inches. The 854-22-0XX-40-001101 is a horizontal surface mount (HSMT) with .016-inch-diameter termination leads held to a .005-inch co-planarity. They each have a .0275-inch working travel (mid-stroke) and a maximum stroke capability of .055 inches +/-.005 inches.
Each series is single row and has standard availability of 1 to 20 positions (higher pin counts available upon request). These connector series are also available with mounting pegs on the insulator housing to provide additional strength and alignment.
For more information contact Mill-Max online at www.mill-max.com.