Embedded computing enclosure for extended-temperature applications introduced by ADL

SAN DIEGO, 4 March 2013. ADL Embedded Solutions Inc. in San Diego is introducing the ADLMES-8200 high IP configurable, modular electronics enclosure for rugged or extended-temperature applications in a variety of industries.

The modular sidewall design of the embedded computing enclosure supports variable PC/104 stack heights, 3.5-inch single-board computers, and other intelligent embedded systems, company officials say.

The modular architecture enables quick-turn, high IP systems, as well as the enclosure's high-availability of inventory, quick-turn custom faceplate and backplate support, and readily available high-IP connectors.

The finned-chassis design allows for conduction cooling through base to airframe or vehicle bulkhead. The design also enables passive cooling via the finned chassis surface which can be augmented with forced cooling. Ingress protection to IP65 is possible with appropriate faceplate and connector options.

For more information contact ADL Embedded Solutions online at www.adl-usa.com.