Embedded computing enclosure for extended-temperature applications introduced by ADL
SAN DIEGO, 4 March 2013. ADL Embedded Solutions Inc. in San Diego is introducing the ADLMES-8200 high IP configurable, modular electronics enclosure for rugged or extended-temperature applications in a variety of industries.
The modular sidewall design of the embedded computing enclosure supports variable PC/104 stack heights, 3.5-inch single-board computers, and other intelligent embedded systems, company officials say.
The modular architecture enables quick-turn, high IP systems, as well as the enclosure's high-availability of inventory, quick-turn custom faceplate and backplate support, and readily available high-IP connectors.
The finned-chassis design allows for conduction cooling through base to airframe or vehicle bulkhead. The design also enables passive cooling via the finned chassis surface which can be augmented with forced cooling. Ingress protection to IP65 is possible with appropriate faceplate and connector options.
For more information contact ADL Embedded Solutions online at www.adl-usa.com.
John Keller | Editor
John Keller is editor-in-chief of Military & Aerospace Electronics magazine, which provides extensive coverage and analysis of enabling electronic and optoelectronic technologies in military, space, and commercial aviation applications. A member of the Military & Aerospace Electronics staff since the magazine's founding in 1989, Mr. Keller took over as chief editor in 1995.