SIDNEY, N.Y., 12 Jan. 2011. Amphenol Industrial in Sidney, N.Y., is introducing three compact, high-amperage, ROHS-compliant RADSOK printed circuit board connectors for power bus applications such as high-power bus assembly utilities, power-to-board servers, power-to-box servers, and battery power/chargers for electric vehicles.
RADSOK technology uses a hyperbolic, stamped grid configuration that ensures a large, coaxial, face-to-face surface area engagement to make the most of heat dissipation and reduce failures in high-current, single-point connections.
The RADSERT connector, which gives designers the option of bringing power to the board from busbars suspended above or below the board and its components comes in press-fit and solder versions, and is available in either a 0.094-inch size and rated for as much as 35 Amps or a 0.141-inch size and rated for as much as 70 Amps. It is for a board thickness of +/-0.250 inches +/-0.025 inches, with custom sizes available.
Also able to provide 70 Amps to a circuit board, the 0.500-by-0.500-inch PowerBlok has a touch-proof cover and many points of contact. The connector's backplane power interface uses pins that are press-fit into the circuit board to help make a solid connection and an even signal flow.
For more information contact Amphenol Industrial online at www.amphenol-aerospace.com.