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    1. Computers

    6U VPX liquid-cooled chassis introduced by Elma for ground-mobile and other harsh-environment applications

    Dec. 1, 2011
    FREMONT, Calif., 1 Dec. 2011. Elma Electronic Inc. in Fremont, Calif., is introducing a liquid-cooled chassis available with a 6U OpenVPX backplane for dense embedded computing systems with substantial heat-dissipation requirements such as rugged ground-mobile and harsh-environment applications that must maintain controlled temperatures and require light-weight components. The rugged chassis holds 6U conduction-cooled boards with a 1-inch pitch per VITA 48.2 (REDI) and VITA 65 (OpenVPX). The 1 ATR tall, short enclosure with independent dual liquid cooled side walls offers better cooling than conduction-only and air-flow designs, Elma officials say. 
    Pennwell web 376 420
    FREMONT, Calif., 1 Dec. 2011. Elma Electronic Inc. in Fremont, Calif., is introducing a liquid-cooled chassis available with a 6U OpenVPX backplane for dense embedded computing systems with substantial heat-dissipation requirements such as rugged ground-mobile and harsh-environment applications that must maintain controlled temperatures and require light-weight components.The rugged chassis holds 6U conduction-cooled boards with a 1-inch pitch per VITA 48.2 (REDI) and VITA 65 (OpenVPX). The 1 ATR tall, short enclosure with independent dual liquid cooled side walls offers better cooling than conduction-only and air-flow designs, Elma officials say. The chassis is available with a 6U OpenVPX backplane on a 1-inch pitch per VITA 65 Backplane Profile BKP6-CEN07-11.2.3-n.The backplane provides seven slots, and each slot cools as much as 100 Watts of waste heat. One slot is for storage, one is for switch, and five slots are for payloads. Additional backplanes are available, including VME, VME64x, VXS, CompactPCI, or custom backplanes. Different front I/O configurations also are possible, such as MIL-STD wiring and connectors, to meet specific application requirements.

    The rugged chassis has a commercial off-the-shelf (COTS) modular design according to ARINC 404A. The all-aluminum chassis has electron beam welded fluid channels in the side walls that can use a variety of cooling fluids, including dielectric fluids (PAO), inhibited glycol/water solutions (PGW, EGW), kerosene, de-ionized water and salt water.

    The unit offers users a fixed-mount 400-Watt or 500-Watt 6U plug-in power supply, and measures 10.625 by 10.12 by 12.52 inches. This enclosure is designed to meet shock and vibration standards per MIL-STD-810G, as well as MIL-STD-810F, MIL-STD-901D and MIL-STD-461F (CE102, CS101, CS116, RE102, RS103).

    It can operate at altitudes as high as 75,000 feet, operate in temperatures from -55 to 70 degrees Celsius, and store in temperatures from -62 to 95 C.

    For more information contact Elma Embedded Computing Products online at www.elmasystems.com.

    About the Author

    John Keller | Editor

    John Keller is editor-in-chief of Military & Aerospace Electronics magazine, which provides extensive coverage and analysis of enabling electronic and optoelectronic technologies in military, space, and commercial aviation applications. A member of the Military & Aerospace Electronics staff since the magazine's founding in 1989, Mr. Keller took over as chief editor in 1995.

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