6U VPX liquid-cooled chassis introduced by Elma for ground-mobile and other harsh-environment applications
FREMONT, Calif., 1 Dec. 2011. Elma Electronic Inc. in Fremont, Calif., is introducing a liquid-cooled chassis available with a 6U OpenVPX backplane for dense embedded computing systems with substantial heat-dissipation requirements such as rugged ground-mobile and harsh-environment applications that must maintain controlled temperatures and require light-weight components. The rugged chassis holds 6U conduction-cooled boards with a 1-inch pitch per VITA 48.2 (REDI) and VITA 65 (OpenVPX). The 1 ATR tall, short enclosure with independent dual liquid cooled side walls offers better cooling than conduction-only and air-flow designs, Elma officials say.
The rugged chassis has a commercial off-the-shelf (COTS) modular design according to ARINC 404A. The all-aluminum chassis has electron beam welded fluid channels in the side walls that can use a variety of cooling fluids, including dielectric fluids (PAO), inhibited glycol/water solutions (PGW, EGW), kerosene, de-ionized water and salt water.
The unit offers users a fixed-mount 400-Watt or 500-Watt 6U plug-in power supply, and measures 10.625 by 10.12 by 12.52 inches. This enclosure is designed to meet shock and vibration standards per MIL-STD-810G, as well as MIL-STD-810F, MIL-STD-901D and MIL-STD-461F (CE102, CS101, CS116, RE102, RS103).
It can operate at altitudes as high as 75,000 feet, operate in temperatures from -55 to 70 degrees Celsius, and store in temperatures from -62 to 95 C.
For more information contact Elma Embedded Computing Products online at www.elmasystems.com.