VITA standards adopts air-flow-through approach to electronics thermal management from Northrop Grumman

Oct. 9, 2011
BALTIMORE, 9 Oct. 2011. Embedded computing designers at the Northrop Grumman Corp. Advanced Concepts and Technologies division in Baltimore have invented a design to improve the air cooling of electronic modules that incorporate an air-flow-through, compact core style heat exchanger design, which opens the door to more powerful, rugged aerospace and defense electronic systems, Northrop Grumman officials say.

BALTIMORE, 9 Oct. 2011.Embedded computing designers at the Northrop Grumman Corp. Advanced Concepts and Technologies division in Baltimore have invented a design to improve the air cooling of electronic modules that incorporate an air-flow-through, compact core style heat exchanger design, which opens the door to more powerful, rugged aerospace and defense electronic systems, Northrop Grumman officials say.

Northrop Grumman's invention enables air flow-through cooling without the air coming into direct contact with the electronics, eliminating the risk of exposure to contaminants in the air. To do this, Northrop Grumman engineers use of sliding air seals at the inlet and outlet of air-flow-through cards, which enables users to remove and replace electronics in the field.

Northrop Grumman not only has patented the new air-flow-through electronics thermal management approach, but also has seen the technology incorporated into VITA 48.5, the mechanical standard governing electronic plug-in units that use air-flow-through cooling. VITA 48.5 is administered by VITA, the open systems and open markets embedded computing trade association in Fountain Hills, Ariz. Northrop Grumman also is looking to license the new air-flow-through cooling technology to other companies.

The technology has received U.S. Patent Number 7,995,346 for the "ruggedized, self-aligning, sliding air seal for removable electronic units."

For more information contact Northrop Grumman Advanced Concepts and Technologies online at www.es.northropgrumman.com, or VITA at www.vita.com.

About the Author

John Keller | Editor

John Keller is editor-in-chief of Military & Aerospace Electronics magazine, which provides extensive coverage and analysis of enabling electronic and optoelectronic technologies in military, space, and commercial aviation applications. A member of the Military & Aerospace Electronics staff since the magazine's founding in 1989, Mr. Keller took over as chief editor in 1995.

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