Microsemi helps alleviate board obsolescence with multichip memory for TI Sitara, OMAP, and DaVinci processors

IRVINE, Calif., 14 July 2011. Microsemi Corp. in Irvine, Calif., is introducing a multichip memory product as a drop-in replacement for the discontinued Micron memory package in Texas Instruments processors. The MS29C2G24MAKLA1-XI is compatible with TI processor families that are enclosed in Micron Technology's end-of-life package-on-package 152-pin ball grid array. The replacement package enables users to avoid board redesign, company officials say.

Jul 14th, 2011

IRVINE, Calif., 14 July 2011. Microsemi Corp. in Irvine, Calif., is introducing a multichip memory product as a drop-in replacement for the discontinued Micron memory package in Texas Instruments processors. The MS29C2G24MAKLA1-XI is compatible with TI processor families that are enclosed in Micron Technology's end-of-life package-on-package 152-pin ball grid array. The replacement package enables users to avoid board obsolescence and board redesign, company officials say.

The component is compatible with TI's Sitara, OMAP, and DaVinci processors. The initial product has the same footprint as Micron's MT29C2G24MAKLACG-XIT. Additional features include LPDDR and LPDDR+ flash and are designed to support TI OMAP35xx, AM37x and DM37x processors.

For more information contact Microsemi online at www.microsemi.com.

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