Emerson introduces plastic-packaged MicroTCA system for industrial automation

TEMPE, Ariz., 27 Feb. 2008. Emerson Network Power (formerly Motorola Embedded) in Tempe, Ariz., is introducing the Centellis 500 deployable MicroTCA system with plastic packaging, MicroTCA carrier hub, (MCH) and high-performance processor module.

Made of an injection-molded plastic enclosure that houses a MicroTCA backplane, fans, power module, MCH, PrAMC 7211 processor Advanced Mezzanine Card (AMC) and three additional AMC payloads, the Centellis 500 supports enterprise-level applications like IP-PBX, packet processing, VoIP gateway, and industrial automation.

For more information contact Emerson Network Power online at www.EmersonNetworkPower.com/EmbeddedComputing.