The military-quality parts operate in temperatures from -55 to 125 degrees Celsius, and offer low power operations, as well as security, high reliability. The devices have high-speed serial I/O, embedded DSP and memory, with built-in security and anti-tamper capabilities.
The parts enable defense and aerospace developers to capitalize on SmartFusion2 and IGLOO2 in data-centric communications and net-centric capabilities that are projected to drive the military communications market to reach $30 billion by 2022, analysts say.
Microsemi's military-temperature tested SmartFusion2 SoC FPGAs and IGLOO2 FPGAs are sampling with full production expected this fall. For more information contact Microsemi online at www.microsemi.com.