Officials of the Defense Logistics Agency Land & Maritime segment in Columbus, Ohio, have announced plans to solicit a long-term contract with Disan Engineering for a multi-layer rigid and flex interconnect assembly that connects about 1,500 circuits for the navigation system in the C-130 aircraft.
The Disan 11250 design provides the interconnections internally, as well as provides shielded paths for many of the circuits. Some shielded circuits consist of several leads encased in a flexible shield, which is subsequently encased in a flexible master layer shield.
The interconnect product is for the Teledyne AN/APN-218 Doppler radar navigation system on the C-130 aircraft. The system also is for the Boeing B-1B bomber, Boeing B-52G/H bomber, and Boeing KC-135 mid-air refueling aircraft.
The terminations of the flex circuits are done on a rigid multi-layer printed circuit board to alleviate the normal separation problems typically found in flex circuitry.
Companies interested in becoming approved sources for the interconnect should respond no later than today, 17 Feb. 2014. Defense Logistics Agency officials say they need about 34 of these interconnect products each year.
Companies interested in becoming approved sources for the backplane interconnect should email the Defense Logistics Agency's Charles Mielke at [email protected].
Necessary documents and additional information are online at https://www.fbo.gov/spg/DLA/J3/DSCC/SPE7MX-13-R-0067 /listing.html.
For more information contact Disan Engineering Corp. online at www.disancorp.com.