TAIPEI, TAIWAN, 30 May 2009. RFaxis, an Irvine, California-based fabless semiconductor company focused on Linknext-generation RF solutions, is readying its first two chips for debut: the RFX2401 and RFX2402.
RFaxis' single-chip, single-die, RFX2401 and RFX2402 are poised to replace conventional larger, multi-die front-end modules, says a company representative. Leveraging BiCMOS technology, RFaxis' chips are designed to reduce the complexity of wireless designs, lower manufacturing costs via a smaller footprint and reduced bill of materials, accelerate time to market, provide superior performance for a competitive advantage, and to be ultra low power to offer improved power efficiency over conventional front-end module technologies.
According to the company, the RFX2401 is the first and only integrated, single-chip, single-die Bluetooth/Zigbee RFeIC (RF Front-end Integrated Circuit) on the market. The chip's architecture integrates the PA, LNA, transmit and receive switching circuitry, the associated matching network, and the harmonic filter all in a BiCMOS single-chip, single-die device.
Designed for use in Bluetooth Class-1 and Single-Port Zigbee applications, the RFX2401 combines high performance, high sensitivity and efficiency, low noise, small form factor, and low cost, and is well suited to applications requiring extended range and bandwidth with a potential 10x range increase. With an integrated power detect circuit, the RFX2401 requires only one external power supply capacitor and the desired band-pass filter for the TX-RX port.
Featuring the same architecture and features as the RFX2401, the RFX 2402 WLAN RFeIC is designed for use in 802.11x and Dual-Port Zigbee applications operating at 2.4GHz. For single antenna applications and/or the building block for MIMO applications, the RFX2402 also requires the same minimal external components as the RFX2401.
