Fine-pitch bump adapters from Aries help designers use high-pitch devices on small-pitch boards

BRISTOL, Pa., 4 Aug. 2010. Aries Electronics in Bristol, Pa., is introducing fine pitch bump adapters that accommodate boards with pitches down to 0.4 millimeters to enable embedded systems designers to use high-pitch devices on small-pitch boards. The adapter tops have landing pads that can be designed to accept any device on any pitch and settle into fine-pitch footprints including thin-shrink small outline packages (TSSOP) and quad flat packages (QFP) with pitches as small as 0.4 millimeters. In addition, the adapter bottom has connection pads raised as high as 0.01 inches.

Aug 4th, 2010
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BRISTOL, Pa., 4 Aug. 2010.Aries Electronics Inc. in Bristol, Pa., is introducing fine pitch bump adapters that accommodate boards with pitches down to 0.4 millimeters to enable embedded systems designers to use high-pitch devices on small-pitch boards.

The adapter tops have landing pads that can be designed to accept any device on any pitch and settle into fine-pitch footprints including thin-shrink small outline packages (TSSOP) and quad flat packages (QFP) with pitches as small as 0.4 millimeters. In addition, the adapter bottom has connection pads raised as high as 0.01 inches.

Due to the open space available on the top of the adapter board, manufacturers can add components to the design at a minimal cost, company officials say. Fine-pitch bump adapters help integrate high-pitch BGA devices with boards laid out with small pitches that typically could not be used together. The apparatus can operate in temperatures to 105 degrees Celsius for FR4 and 130 C for lead-free.

The adapters are available in tape and reel for high speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003 inches can be used.

For more information contact Aries Electronics online at www.arieselec.com.

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