Rugged small-form-factor USB expansion embedded boards with SUMMIT interface introduced by VersaLogic

EUGENE, Ore., 22 Nov. 2010. VersaLogic Corp., a Eugene, Oregon-based manufacturer of embedded computing products, is introducing two expansion modules for use with the company's Stackable Unified Module Interconnect Technology (SUMMIT) interface standard developed by the Small Form Factor Special Interest Group (SFF-SIG) in Santa Clara, Calif. VersaLogic's SUMIT interface provides signaling options for system expansion, including multiple high-speed PCI Express lanes, USB, LPC, SPI, and SMBus.

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EUGENE, Ore., 22 Nov. 2010. VersaLogic Corp., a Eugene, Oregon-based manufacturer of embedded computing products, is introducing two expansion modules for use with the company's Stackable Unified Module Interconnect Technology (SUMMIT) interface standard developed by the Small Form Factor Special Interest Group (SFF-SIG) in Santa Clara, Calif. VersaLogic's SUMIT interface provides signaling options for system expansion, including multiple high-speed PCI Express lanes, USB, LPC, SPI, and SMBus.

The SUMIT-micro format is 1/3 the width of PC/104 or SUMIT-104 expansion modules, company officials say. SUMIT-micro expansion boards are 90 by 32 millimeters, attach to the SUMIT connector, and are secured via two mounting holes using standard standoffs.

These boards provide as many as four additional USB ports. The VL-EPHs-B1A model provides four USB ports (two Type A connectors and two on pin headers). The VL-EPHs-B1B provides three USB ports (one Type A connector and two on pin headers) and one eUSB flash memory expansion site.

Both versions operate in the industrial temperature range of -40 to 85 degrees Celsius, are RoHS compliant, and meet MIL-STD-202G for mechanical shock and vibration. For more information contact VersaLogic online at www.versalogic.com.

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