PITTSBURGH, 19 Jan. 2007. Ansoft Corporation -- a developer of electronic design automation (EDA) software used by engineers to design state-of-the-art electronic products, such as Internet-access devices, broadband networking components and systems, integrated circuits (ICs), printed circuit boards (PCBs), and power electronics -- has unveiled Turbo Package Analyzer (TPA) version 5.
The latest version of TPA introduces new automation, design flow, and simulation capability needed for the extraction of the electrical characteristics of complex high-performance ball-grid array (BGA) style packaging, including wirebond (WBBGA), flip-chip (FCBGA), chip-scale packages (CSPs), and System in Packages (SiP).
TPA v5 increases the capacity of the solver to address larger-sized packaging problems and introduces greater automation for generating and/or modifying 3D package layouts. TPA v5 introduces a new user interface that includes new 2D editing and 3D viewing capabilities, unlimited undo/redo capability, new editing and automation features, and support for VB scripting.
Combined with AnsoftLinks, a tool for simplifying data import and export between EDA and CAD packages, TPA v5 generates resistance, inductance, and capacitance (RLC) models directly from popular package design tools.
It accepts CAD data and fully characterizes the package in three dimensions. Extracted sub-circuits can be exported into Nexxim, the company's circuit simulation software, or existing SPICE tools (SPICE/IBIS format) for subsequent transient analyses, such as crosstalk, overshoot, and TDR.
