Rugged modular electronics enclosures for high-reliability applications introduced by Pixus

Nov. 30, 2017
WATERLOO, Ontario – Pixus Technologies in Waterloo, Ontario, is introducing the RiCase Premier line of rugged modular electronics enclosures for military, aerospace, energy exploration, and other applications that require weight load support and reliability.

WATERLOO, Ontario – Pixus Technologies in Waterloo, Ontario, is introducing the RiCase Premier line of rugged modular electronics enclosures for military, aerospace, energy exploration, and other applications that require weight load support and reliability.

The electronics enclosures come in 3U height at a 300-millimeter depth and a 4U height at a 420-millimeter depth. The new sizes expand the range of 10.5- and 19-inch-wide instrumentation cases, offering more standard choices.

The Pixus RiCase series of instrumentation cases combine a rugged design and an attractive all-metal design. The corners are rounded for aesthetics, mechanical protection, and to prevent snags and injuries.

They also have the option of securely stacking on top of another RiCase enclosure. There are three standard color codes, which can signify the end-user's product line.

Related: Rails and components for embedded computing enclosure subracks offered by Pixus Technologies

With a modular design, there are a range of size options from 1U to 10U heights, 19- and 10.5-inch widths, and 300-, 420-, and 540-millimeter depths.

Customized sizes also are available upon request. There also are provisions for mounting slide-in equipment and modular assemblies at regular intervals per DIN and IEC 60 specifications.

With a rugged design, the RiCase enclosures have vented and non-vented covers available, as well as several front- and rear-panel options, including hinged doors in metal or acrylic glass.

For more information contact Pixus Technologies online at www.pixustechnologies.com.

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