Mercury uses BGA conversion to ruggedize Intel Xeon processor scalable for military applications

ANDOVER, Mass. – Mercury Systems Inc. in Andover, Mass., is using the company's ball grid array (BGA) packaging conversion technology to ruggedize the Intel Xeon processor scalable family for aerospace and defense embedded computing applications.

Jul 26th, 2017
By Mil & Aero staff
By Mil & Aero staff

ANDOVER, Mass. – Mercury Systems Inc. in Andover, Mass., is using the company's ball grid array (BGA) packaging conversion technology to ruggedize the Intel Xeon processor scalable family for aerospace and defense embedded computing applications.

The technology converts the land grid array (LGA) package on standard Intel Xeon server CPUs to the more rugged BGA package to create a rugged server-class processing option in an open-system architecture.

Once converted to BGA, the Intel Xeon processors is suitable for deployed military applications on aircraft, surface vessels, and land vehicles that operate in harsh-temperature and -vibration conditions.

Mercury's BGA conversion technology has been deployed on several systems that use the previous-generation Xeon processors. Combined with using military-grade solder balls and underfill, this BGA conversion eliminates the risk of thermal expansion or contraction of the package that could cause cracking or opens.

Mercury plans to use the BGA-converted Intel Xeon processor scalable family in its OpenVPX, ATCA, and Secure Rack Server products. For more information contact Mercury Systems online at www.mrcy.com.

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