Gold-plated carrier connector for board-to-board interconnects introduced by Mill-Max

OYSTER BAY, N.Y. – Mill-Max Mfg. Corp. in Oyster Bay, N.Y., is introducing the 3169-0-61-15-00-00-03-0 male pin carrier connector using thin Kapton film to create ultra-low-profile interconnects for low-profile board to board connections.

By Mil & Aero staff
By Mil & Aero staff

OYSTER BAY, N.Y. – Mill-Max Mfg. Corp. in Oyster Bay, N.Y., is introducing the 3169-0-61-15-00-00-03-0 male pin carrier connector using thin Kapton film to create ultra-low-profile interconnects for low-profile board-to-board connections.

The product has a double tail circuit board pin mounted in .005-inch thick Kapton film and tape. The Kapton can be removed after soldering but if left in place does not add to the interconnect height of .030 inches.

The pins are spaced at 0.1-inch pitch to enable designers to assemble several pins onto the circuit board at once; making low volume, manual assembly more efficient. Kapton film and tape is a high-temperature polyimide material.

These circuit board pins are precision turned from brass alloy and are gold plated for interconnect reliability, corrosion protection, and wear resistance.

The packaging is a continuous strip spool of 1,000 pins, which the user can cut into strips. For more information contact Mill-Max online at www.mill-max.com.

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