High-frequency nanominiature contact for rugged VPX embedded computing introduced by TE Connectivity

Nov. 12, 2018
HARRISBURG, Pa. – TE Connectivity in Harrisburg, Pa., is introducing the NanoRF modules and contacts, which double the density of today's VITA 67 RF modules for VPX embedded computing applications.

HARRISBURG, Pa. – TE Connectivity in Harrisburg, Pa., is introducing the NanoRF modules and contacts, which double the density of today's VITA 67 RF modules for VPX embedded computing applications.

This high-frequency nanominiature coax contact is engineered with small contacts and a high RF contact density within a multi-position module.

This design enables relatively small packaging and saves valuable space. Half-size modules can support as many as 12 RF contacts and full-size modules can support 18 or more contacts, with the option to customize contact count and position.

TE's NanoRF modules offer blind-mateable, float-mounted backplane contacts that support module-to-module or box-to-box architectures. The nanominiature contact is designed for 0.047-inch coax cable, yet several cable types are available.

To bring high-frequency capability into a high-density modular package, the contacts are optimized for signal integrity and support frequencies as high as 70 GHz.

The rugged NanoRF's design features a floating insert on the backplane side, with guide features to pre-align the array of contacts before they engage. The device offers as many as 500 mating cycles.

For more information contact TE Connectivity online at www.te.com.

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