Power connectors to deliver high current density for mass-storage introduced by TE Connectivity

Dec. 5, 2018
HARRISBURG, Pa. – TE Connectivity in Harrisburg, Pa., is introducing the high density plus (HD+) card edge power connectors to deliver high current density to card edge power connectors in server, switch, and mass-storage system applications.

HARRISBURG, Pa. – TE Connectivity in Harrisburg, Pa., is introducing the high density plus (HD+) card edge power connectors to deliver high current density to card edge power connectors in server, switch, and mass-storage system applications.

Capable of supporting power supplies as strong as 3 kilowatts, these connectors are designed to deliver current density at 15 amps per 2.54 millimeters, and support 2000-to-3000-Watt power supplies for data center equipment.

The connectors have a 1.27-millimeter signal contact pitch and a 5.08-millimeter power contact pitch with a working voltage of 60 volts DC.

TE's HD+ card edge power connectors offer low contact resistance due to a unique dual-layer design of DC power contacts and pass-through pins, which provide multiple mating and contact points to the circuit board.

Designed in the common industry circuit board footprint, these connectors have a compact design with a common power and signal contact module. The connectors support AC and DC in low-power and high-power applications.

For more information contact TE Connectivity online at www.te.com.

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